Q：When using high-precision 34-layer laser blind hole PCB, what should I do if I encounter unstable signal transmission?
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First, check the power and signal connections to make sure they are not loose or in poor contact. Second, check the PCB surface and connection areas for visible foreign matter or oxidation, and clean them.
Q：What are the suggestions for daily maintenance of high-precision 34-layer laser blind hole PCB products?
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In order to ensure the long-term reliability and optimal performance of the high-precision 34-layer laser blind via PCB, the following daily maintenance is recommended:
1. Regular cleaning: Use a non-static brush and dust-free cloth to clean the surface to avoid dust and impurities that affect circuit conductivity.
2. Temperature and humidity control: Keep the storage environment temperature at 20-25 degrees Celsius and the humidity at 40-60%RH to avoid excessively high or low temperature and humidity affecting the performance of the board.
3. Anti-static measures: During operation and storage, use anti-static packaging and anti-static gloves to avoid static damage to circuit boards.
4. Check the connections: Check the circuit connection points regularly to ensure that there is no corrosion or looseness.
5. Physical protection: Prevent the circuit board from external impact or bending to prevent mechanical damage from affecting the function of the circuit board.
6. Environmental monitoring: Avoid contact of circuit boards with harmful chemicals and liquids, especially acids and alkalis, to prevent chemical corrosion.
Q：What fields are high-precision 34-layer laser blind hole PCB mainly suitable for?
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High-precision 34-layer laser blind via PCB is mainly suitable for the following fields: semiconductor testing equipment, providing a stable high-performance electronic testing environment; high-precision control requirements in industrial automation and medical equipment; high-density electronic integrated systems, such as communication equipment and 5G network base stations; new energy products, including solar inverters and electric vehicle electronic control units; high-end consumer electronics products, such as advanced computer systems and large servers, all require multi-layer PCBs with high reliability.
Q：How to maintain and preserve the product in the later stage?
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In order to ensure the long-term stable operation and high-efficiency performance of high-performance multi-layer PCB circuit boards, the following maintenance and maintenance measures are recommended: 1. Anti-static treatment: Anti-static protection should be done during operation and storage to avoid static damage to the PCB board. 2. Environmental control: The storage environment should be controlled at a temperature of 20-25℃ and a relative humidity of 50-60% to avoid the impact of high temperature and high humidity on the performance of the circuit board. 3. Regular inspection: Regularly inspect the appearance of the PCB board to check whether there is physical damage, corrosion marks or other abnormal conditions. 4. Proper cleaning: Use anhydrous alcohol or special circuit board cleaner for cleaning, and avoid using corrosive chemicals to avoid affecting the solder joints and circuits. 5. Board surface maintenance: During the PCB board assembly process, the board surface should be kept clean to avoid oil stains, water stains, etc. from contaminating the solder joints and circuits. 6. Reasonable use: Ensure that the PCB board is used according to the design requirements and does not exceed its rated current and operating temperature range to extend its life and maintain good performance. Through the above maintenance and maintenance measures, the service life and performance stability of the PCB circuit board can be effectively improved.
Q：How to install the product?
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The installation steps of high-performance multi-layer PCB circuit boards are as follows: 1. Check the package: Open the package and check the integrity of the PCB circuit board to ensure that there is no physical damage or information marking errors. 2. Clean the circuit board: Use a dust-free cloth and anhydrous alcohol to clean the PCB surface to ensure that there is no dust and grease. 3. Prepare the welding environment: Adjust the working environment to be suitable for welding, and ensure that the temperature, humidity and electrostatic protection meet the standards. 4. Install electronic components: According to the circuit design diagram, place each electronic component (such as resistors, capacitors, ICs, etc.) correctly in the reserved solder joint positions on the PCB. 5. Solder components: Use appropriate soldering tools and solder to solder the components on the PCB. The surface of the immersion gold process helps to achieve excellent welding results. 6. Check the connection: After completing the soldering, check all the solder joints on the circuit board to ensure that there is no virtual soldering, false soldering or short circuit. 7. Test function: Use a test instrument to perform functional tests on the soldered PCB to verify its electrical conductivity and thermal dispersion. 8. Fixed installation: Install the tested PCB into the corresponding equipment, ensure that it is fixed securely, and connect the relevant interfaces. The above steps should be performed under the guidance of professional technicians or in accordance with professional standard operating specifications to ensure installation quality and product reliability.
Q：What should you pay attention to when using high-performance multi-layer PCB circuit boards?
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When using high-performance multi-layer PCB circuit boards, please pay attention to the following: 1. Ensure the operating environment is clean to prevent dust and other particles from contaminating the surface of the circuit board and affecting performance and reliability. 2. Avoid mechanical shock or bending of the circuit board during operation to prevent damage to the internal circuits. 3. When performing soldering operations, keep the temperature within the product's tolerance range (applicable to immersion gold process) to avoid damage to the circuit board due to excessive temperature. 4. Use appropriate anti-static measures to prevent electrostatic discharge from damaging the PCB and its components. 5. Pay attention to the storage environment of the circuit board and try to avoid high humidity to prevent oxidation and corrosion. The above precautions can ensure the effective use and long-term reliability of the PCB circuit board.
Q：Question: What key technologies are used in the lead-free immersed tin 6-layer high-frequency 5G PCB board launched by Mingzhenghong Electronics to ensure its high stability and performance?
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Answer: Mingzhenghong Electronics' lead-free immersed tin 6-layer high-frequency 5G PCB board uses a number of key technologies to ensure its high stability and performance in the field of high-speed communications. First of all, this product is made of FR-4 TG150 high-temperature heat-resistant material, which can withstand higher operating temperatures and improves the stability and durability of the PCB board. In addition, to improve conductivity and heat distribution efficiency under high loads, a 2-ounce heavy copper layout is used on both the inner and outer layers of the PCB. In terms of accuracy, this product has a line width/line spacing of 0.1 mm and a minimum aperture of 0.15 mm to meet complex circuit design needs. In terms of thickness control, the plate thickness is accurately controlled at 1.0 mm ± 0.1 mm to ensure assembly consistency and mechanical strength. The surface treatment adopts an environmentally friendly lead-free immersion tin process. The thickness of the immersion tin is 1 micron, which provides good solderability and reliability and complies with RoHS environmental standards.
Q：Question: What special process is used in the 26-layer high-density interconnect (HDI) circuit board produced by Mingzhenghong Electronics to ensure a stable and reliable connection between circuit layers?
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Answer: The 26-layer high-density interconnect (HDI) circuit board produced by Mingzhenghong Electronics adopts high-precision laser drilling technology, implements 2-level blind hole and buried hole technology, and cooperates with 3-time lamination process. This combination of advanced processes ensures a solid and reliable connection between circuit layers and meets the high performance and reliability requirements of electronic products.
Q：Question: What are the manufacturing technology characteristics of the precision high-speed multi-layer IC substrates and PCBs provided by Mingzhenghong Electronics?
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Answer: Mingzhenghong Electronics uses cutting-edge PCB manufacturing technology to produce precision high-speed multi-layer IC substrates and PCBs. These technologies meet the fine requirements of the semiconductor level and ensure the high performance and stability of the circuit board. The company supports a minimum line width/space of 0.075 mm and a minimum via hole diameter of 0.2 mm. This ultra-fine line design meets the needs of complex circuits and improves signal transmission efficiency. In addition, it can support up to 8-layer IC substrate design to adapt to highly integrated electronic products and optimize signal layout and thermal management. The company uses high-quality immersion gold (ENIG) technology for surface treatment, which enhances the corrosion resistance and welding reliability of the board. Moreover, it integrates advanced packaging technologies such as FC-CSP and PBGA to provide short-distance interconnect solutions for high input/output (I/O) counts, achieving higher layout density and superior electrical performance. These high-precision manufacturing technologies and material selections enable Mingzhenghong to provide industry-leading circuit board solutions.
Q：Question: What are the main features and application scenarios of environmentally friendly, high-frequency, stable, lead-free immersed tin multi-layer PCB boards for 5G communications?
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Answer: The main features of this product include the use of FR-4 TG150 high-temperature heat-resistant material to ensure the stability and durability of the PCB board in high-temperature environments; 2-ounce heavy copper is laid out on the inner and outer layers to improve performance under high-load applications. Excellent electrical conductivity and heat transfer efficiency; line width/line spacing reaches 0.1 mm, and the minimum aperture is 0.15 mm. This high-precision technology supports fine circuit design requirements; the board thickness is accurately controlled at 1.0 mm ± 0.1 mm, ensuring assembly consistency and Mechanical strength; the surface treatment adopts environmentally friendly lead-free immersion tin process, which not only provides excellent welding performance, but also complies with RoHS environmental standards. These characteristics make this PCB board suitable for 5G base stations, routers, switches and other communication motherboards/sub-boards used in the field of high-speed communications, as well as smartphones, tablets, complex computer systems, automated industrial equipment and medical instruments to optimize signal transmission. and ensure high-precision operation of equipment.
